Solutions for R&D and manufacturing of semiconductor devices, MEMS, displays
We have unique experience in creating lithography processing equipment, including modules and systems for coating, developing, substrate cleaning, baking and lift-off. The developed product range includes systems for wafers up to 300 mm and substrates of different shape with size up to 1,500 Ч 1,500 mm. Depending on customer requirements, different technologies can be used in processing equipment, for example spin coating or spray coating. We supply both the modules with different degree of automation and fully automatic microcluster systems. The main target markets are the manufacturing of semiconductor devices, MEMS, including systems with piezo layers, displays based on organic LEDs, as well as research and development.
What developments and innovations are the most important to the success?
First and foremost, I would like to highlight our competencies in the field of creation of equipment for substrates of large size, providing processing with uniformity deviation of less than 1%. The thickness of coatings can range from several micrometers to tens of nanometers. Patented Rotated Covered Chuck Technology (RCCT) eliminates rotational corner effects to achieve the best uniformity on rectangular substrates, prevents excessive heating of glass substrates, reduces media consumption, eliminate splashing on cover plate, due to the self-cleaning Venturi effect reduces build-up of waste materials. RCCT can be used for processing of substrates with a size up to 1,500Ч1,500 mm, and of small wafers, including possibility of coating wafers on both sides for MEMS applications.
I would like to mention that our systems have modular design and are built on unified platforms. It allows to create cost effective solutions for research and development, small and high volume production, which are optimally matched to customers’ requirements.
What trends in the field of lithography processing do you find particularly interesting today?
The obvious trend is the expansion of the range of materials and sizes of substrates, in particular, the increasing use of non-silicon materials and large substrates. Accordingly, the range of the used resists increases. With the reduction of node size, the thickness of applied coating decreases, however, the large thickness coatings are also in high demand in special fields. The number of special applications increases, about half of our customers are associated with the defense and space industries, and, as a rule, they require the development of individual configurations. In response to these challenges, we try to give customers more attention, carefully studying the demand so that our new products meet market trends.
How did you assess the Russian market?
In cooperation with our partners from Maicom Quarz GmbH, we have experience of installation in Russia of more than 40 modules and microcluster systems, including for processing of large substrates, manufacturing of MEMS, LEDs and other applications. Currently, the investment ability of Russian enterprises has decreased, but I believe that in the short term the demand will recover.
Interview: Dmitry Gudilin