The study highlights the results of mechanical stresses occurred in a sensitive element (SE) under package, as well as mechanical stresses effect on output characteristics based on an exemplary pressure microsensor (PMS). The paper gives data on digital simulation of SE chip strain caused by thermal expansion — compression at packaging SE chip in the support chip-package system. A search has been performed for a support chip structure which makes it possible to reduce mechanical stresses under temperature variations and to assure mechanical decoupling between SE itself and the device package.


Разработка: студия Green Art