rus
Special Issue/2019
L. I. Dolgovykh A. I. Vinogradov N. M. Zaryankin M. S. Mikhailova A. V. Brykin
Features of eutectic bonding MEMS technology
Features of eutectic bonding MEMS technology
The paper presents the process of eutectic silicon wafers bonding using a thin gold layer deposited on one of bonding wafers. When testing samples after the process, there occurred the problem of uneven gold distribution across the substrate. To avoid the gold spreading effect after bonding, a damping air clamp has been developed.
The paper presents the process of eutectic silicon wafers bonding using a thin gold layer deposited on one of bonding wafers. When testing samples after the process, there occurred the problem of uneven gold distribution across the substrate. To avoid the gold spreading effect after bonding, a damping air clamp has been developed.
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