Rapid Thermal Processing for R&D and unique thin-film technology
Rapid thermal processes can be divided into three types: resident, when the structure of the material is modified by heating; surface interaction, when a reactive gas is added during the heating process and rapid thermal CVD (RTCVD). The first type of process is used, for example, for implant annealing, ohmic contact annealing, diffusion of dopants, the second type is used for oxidation, nitridation, selenization, silicon carbonization. RTCVD is used to obtain thin films of graphene, hexagonal boron nitride (hBN), polysilicon and various silicon compounds.
Our company produces equipment for research and development and small scale production. The maximum size of the wafers is from three inches in AS-Micro system to 200 mm in AS-Master. In Zenith-100 system the maximum temperature can reach 2 000 °C.
What are the advantages of the Annealsys’ RTP-systems?
First, our systems are equipped with a water-cooled chambers – a cold wall chamber technology, which provides precise temperature control, minimizes contaminations of the environment, ensures low memory effect, optimal mixing of gases and their uniform distribution over the sample. This achieves high reproducibility of the processes and the ability to work with heat-sensitive materials. Second, our equipment allows RTP under vacuum, which significantly expands the possibilities of obtaining new materials and structures. Finally, I would like to mention the reliability and durability of our equipment.
We began to produce DLI-systems for thin film processes in 2011. The use of direct liquid injection vaporizers offers the possibility of operation with a widest range of chemicals, including low vapor pressure and thermally unstable precursors. In the same process chamber it is possible to implement various processes including CVD, ALD, MOCVD (metal-organic chemical vapor deposition), pulse pressure CVD, rapid thermal processes, RTCVD. Currently we are producing equipment for wafers with maximum size from 2 inch to 200 mm, which is focused primarily on the R & D sector.
What types of equipment are most in demand in the market?
We sell about 25–30 units per year. The major markets are Europe, including Russia, North America and East Asia. In the research centers the AS-One RTP system is especially demanded. It is available in versions for 100 mm and 150 mm wafers, allows heating up to 1 450 °C, is equipped with a cold wall chamber system and can be equipped with a turbo pump as an option. Many manufacturers of MEMS use our AS-Master system for 200 mm wafers. The multi process MC-050, a two-inch system with up to six direct liquid injection vaporizers, is our most popular DLI solution. In Russia, where our partner is Minateh company, several AS-One and AS-Master RTP-systems are installed. I hope that in the near future the Russian researchers will start to use our developments in the field of DLI for thin-film processes.
Interview: Dmitry Gudilin