The paper presents the concept of 3D microassembly technology based on silicon interconnection boards, highlighting the main advantages of the technology for manufacturing small-sized products of microsystem hardware on the base of unpackaged MEMS elements. Besides, it gives the results of research into processes of plated-through holes formation in silicon interconnection boards, as well as designs of domestic accelerometers developed using 3D microassembly technology.


Разработка: студия Green Art