High-precision micro-assembly systems for photonics and optoelectronics
We are leaders in the field of solutions for micro-assembly and testing of photonics, micro-optics and optoelectronics components. Several series of equipment of varying degrees of automation – from semi-automatic to fully automatic machines and production systems are offered to customers that realize precision positioning and alignment, assembly, bonding by welding, soldering or adhesion, as well as optical inspection and testing of the components and devices. The modular design of equipment allows us to create custom-configurable solutions.
What series of equipment does ficonTEC offer?
Abbreviations AA, AL and FL denote systems for high-precision alignment and positioning (AutoAlign), assembly of optical and semiconductor components (AssemblyLine), as well as assembly of fiber-optics with the required number of alignment axes (FiberLine), respectively. They are performed as standalone, as a rule, very compact semi-automatic and automatic machines for operation in a rigid mode in production conditions. The customer can choose the optimal configuration for his portfolio.
BL (BondLine) is designed for bonding in the micron and submicron range with the use of welding, adhesive bonding, as well as laser soldering. CoS (Chips on Submount), MEMS/MOEMS and sensors, photodiodes and LEDs, as well as hybrid devices are manufactured using this equipment. We offer bonding systems of different classes – from solutions for R&D to high-performance industrial systems.
CL (CompactLine) is a modular system for creating user-configurable industrial solutions for micro-assembly of semiconductor and optical devices.
The StackLine series includes a unique SL2000 machine for automated stacking and unstacking of laser diode bars, which allows to obtain any combination of spacers and laser bars. It can be additionally equipped with an optical inspection system after which automatic sorting of devices will be performed.
TL (TestLine) and IL (InspectionLine) series include automatic solutions for optical inspection, as well as for testing, spectral and beam characterization of laser diodes, single chips, VCSELS, CoS and other devices. The number of tasks to be solved can include both testing after dicing and control of the wafers.
In addition to these series, we create special individual solutions, for example, automated lines with robotic modules, and such systems can be very compact.
What trends determine the development of equipment?
The requirements for the precision and performance of semiconductor and optical devices are increasing, while their size is reducing, so we have to constantly improve our machines. It is of fundamental importance for us to offer customers the most advanced solutions that will provide them with advantages over competitors.
What distinguishes ficonTEC solutions from analogues?
The photonics market is relatively young, many things are not standardized, so the variety of technologies and products used is great. In such circumstances, it is very difficult to combine an individual approach to the customer's problems with maintaining prices at a competitive level. But we manage to maintain this balance thanks to the modular design of equipment. It is also very important that when developing new solutions, we start, primarily from the convenience of their application, that is, we look at them through the eyes of the user, not the machine builder.
How do you assess the prospects for the Russian photonics market?
Russia is a country with a high level of development of science and technology in the field of photonics. In cooperation with TBS we have been working on the Russian market for a long time, and we look forward to its further successful development.