The paper presents the results of a study of the feasibility of using a titanium sublayer to increase the adhesion of current-carrying coatings to alumina substrates. Thin-film copper coating was deposited on a substrate of alumina ceramic by thermal evaporation, and the titanium adhesive layer was obtained by magnetron sputtering. It has been found that a titanium sublayer can be used as an adhesive layer for materials that are used for soldering of components.


Разработка: студия Green Art