The development of advanced packaging technologies is changing the semiconductor industry. One of the main innovators in this field is SPTS Technologies, an Orbotech company, that designs and manufactures a wide range of etch and deposition wafer processing systems that are used in the production and packaging of microelectronic devices. Formed in 2009, it brings together over 40 years experience from such companies as Trikon Technologies, STS and Aviza Technology.


Разработка: студия Green Art