The paper presents the results of the development of the script for the analysis of optical images. Using Deriche’s boundary delimitation algorithm, the analysis script allows obtaining critical dimensions (CD) of micro-sized structures captured by an automated optical system. The monitoring of the geometrical parameters of the MEMS products after various technological processes helps to control the processes’ performance which is strictly required by the quality management system maintained in the MEMS manufacturing. The developed technique allows to determine with a high accuracy the critical dimensions of chips located on a silicon or glass wafer. A complete optical inspection of one 100 mm wafer together with image processing takes less than 10 minutes. Although the developed script is designed to control the parameters of wafers of certain types and sizes, the algorithms used allow for a significant expansion of its functionality in the future.


Разработка: студия Green Art