The article describes advantages of flip-chip mounting technology application in a die creation of 2,5D and 3D modification microassemblies. Design and technological features and restrictions of flip-chip die mounting in the manufacture of high-integrated microassemblies are presented. The structure profile estimate results of unpackaged microcircuit surface with microbamps are given. Also the article gives bump profiles after their mounting on the bonding pads of test chips. The shear strength results of the SAC305 bumps from bonding pads with Au-coated dies and from bonding pads with ImmSn-coated silicon substrates are presented in the research.


Разработка: студия Green Art